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IC Substrate Materials

IMS and HTC materials

Special Materials

HSD Materials

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Flexible copper clad laminate

All
Smart Terminal
Rigid Materials
RF Materials
Automotive Materials
Flexible Materials
IC Substrate Materials
IMS and HTC materials
Special Materials
HSD Materials

Flexible copper clad laminate
Coverlay
No-flow prepreg
Stiffener
Bonding film
PET laminated busbar

Environmental Material
Extremely low-loss
HDI
Smart Terminal
IC Substrate
Thermosetting Resin Type
Hydrocarbon Laminate
PTFE Type
Thermal Conductive CEM-3
Thermal Conductive CEM-1
Other
Thermal Conductive FR-4.0
Copper Base CCL
Al Base CCL
Ultra-low Loss Material
Very Low-loss Material
Low-loss Material
Mid-loss Material
Automotive materials
CEM-1
CEM-3, CEM-3.1
Halogen Free and Lead Free Compatible FR-4.1, FR-15.1
Lead Free Compatible FR-4.0, FR-15.0
Conventional FR-4
Flexible copper clad laminate
Coverlay
No-flow prepreg
Stiffener
Bonding film
PET laminated busbar
Rigid Polyimide Material
Semi-flex Material
Special Bonding Prepreg
RCC
Rigid Materials
RF Materials
Automotive Materials
Flexible Materials
IC Substrate Materials
IMS and HTC materials
Special Materials
HSD Materials

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CTI

thermal condu（W/m·K）

CTE

Df_10GHz

Dk_10GHz

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Product List

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product name

Product brief description

CTI

Thermal conductivity（W/m·K）

Df/10GHz

Dk/10GHz

application area

CTE

SF206B

LowDk/Df Bonding film

0.003

2.5

SF315B

Halogen-free type epoxy bonding film

0.02

3.4

Multilayer Module Rigid-Flex Module

SF325B

Anti-ion Migration type bonding film

0.017

3.4

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