產(chǎn)品與市場
LNB33
特點
● 不同頻率下穩(wěn)定的介電性能
● 電子級玻璃纖維布增強無機陶瓷填料和碳氫類樹脂復(fù)合介質(zhì)材料
● 低的Z軸膨脹系數(shù)，優(yōu)異的尺寸穩(wěn)定性
應(yīng)用領(lǐng)域
● LNA/LNB
● 高頻無線通訊
● 衛(wèi)星信號傳輸設(shè)備
● 微帶和蜂窩基站天線
● 基站天線和功放
- 產(chǎn)品性能
- 產(chǎn)品證書
- 資料下載
| Items | Method | Condition | Unit | Typical Value |
|---|---|---|---|---|
|
Dielectric Constant, Process Dk |
IPC-TM-650 2.5.5.5 | C-24/23/50, 10GHz | - | 3.30±0.05 |
| Dielectric Constant, Dk | IEC 61189-2-721 | C-24/23/50, 10GHz | - | 3.45±0.05 |
| Dissipation Factor, Df | IPC-TM-650 2.5.5.5 | C-24/23/50, 10GHz | - | 0.0025 |
| IEC 61189-2-721 | C-24/23/50, 10GHz | - | 0.0032 | |
| Thermal Coefficient of Dk |
IEC 61189-2-721 |
-40~150℃, 10GHz | ppm/℃ | +125 |
| Volume Resistivity | IPC-TM-650 2.5.17.1 | A | MΩ·cm | 6.8 x 108 |
|
Surface Resistivity |
IPC-TM-650 2.5.17.1 |
A | MΩ | 5.3 x 107 |
| Tg | IPC-TM-650 2.4.25 | DSC | ℃ | ＞280 |
| Td | IPC-TM-650 2.4.24.6 | 5% wt. loss | ℃ | ＞400 |
| CTE (Z-axis) | IPC-TM-650 2.4.24 | 30-260℃ | ppm/℃ | 55 |
|
CTE (X/Y-axis) |
IPC-TM-650 2.4.41 | 30-260℃ | ppm/℃ | 13/15 |
| Peel Strength | IPC-TM-650 2.4.8 | 288℃/10s | N/mm [lb/in] | 1.0 [5.71] |
| Flexual Strength | IPC-TM-650 2.4.4 | A | MPa | 235 |
| Water Absorption | IPC-TM-650 2.6.2.1 | D-24/23 | % | 0.1 |
|
Thermal Conductivity |
ASTM D5470 | 100℃ | W/(m·k) | 0.69 |
| Tensile Modulus (LW/CW) | ASTM D638 | A |
GPa |
15.6/19.7 |
| Tensile Strength (LW/CW) | ASTM D638 | A | MPa | 112/143 |
Remarks:
All the typical values listed above are for your reference only and not intended for specification. Please contact Shengyi Technology Co., Ltd. for detailed information. All rights from this data sheet are reserved by Shengyi Technology Co., Ltd.
Explanation: C=Humidity conditioning, D=Immersion conditioning in distilled water, E=Temperature conditioning
The first digit following the letter indicates the duration of preconditioning in hours, the second digit the preconditioning temperature in ℃ and the third digit the relative humidity.